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Tohoku University and Tsinghua University have contributed funds to support research and exchange activities jointly conducted by researchers at both universities since 2019.

If you wish to apply for this third round of funding, submit an application form by February 24, 2021 after consultation with appropriate colleagues at Tsinghua University.

Online Application Period:

From December 11, 2020 (Fri) to February 24, 2021 (Wed).

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Applications from all fields are welcome. Priority will be given to proposals from the following fields: Materials Science, Spintronics, and Disaster Science.

Funding Period:

From April 1, 2021 (Thu) to March 31, 2023 (Fri)
※However, due to both universities' financial years being different, the funding periods at each university will differ.

Application Guidelines (PDF)
Application Form (Word)

Please submit all applications to the Tohoku University Global Engagement Division at the email address below.

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